Ball Screw Drive Linear Module

Basic Concept

Ball screw drive linear module, which we also often call ball screw module, is a precise transmission device, mainly used to efficiently and accurately convert rotary motion into linear motion.

• 

  Two-axis H-type lead screw linear stage module

• 

  Two-axis ball screw cross-slide module

Product Drawing

Product Superiority

 High precision: the rolling contact mode of the ball screw can effectively reduce friction and provide high precision transmission.
 Low friction: Compared to ordinary ordinary screw, ball screw has less friction and can reduce energy consumption.
 High load capacity: Ball screws can withstand large loads and are suitable for heavy duty applications.

Mechanism Construction

Product Application

Machine tool industry: In CNC machine tools, such as milling machines, lathes, drilling machines, etc., screw linear modules are used to accurately position and cut machining workpieces, which can achieve high-precision and high-efficiency metal processing.
Automation equipment field: Often used in automated production lines and robots, such as material handling, positioning and fine tuning of processing equipment on the assembly line, which can ensure the accurate transmission of materials and the accurate operation of equipment.
Precision instrument manufacturing: In optical instruments, measuring instruments and other precision equipment, the screw linear module provides smooth and accurate linear motion to meet the high-precision adjustment needs, helping to improve the measurement accuracy and performance of the instrument.
Medical device industry: Used in medical equipment and surgical instruments, such as automatic insertion and fine-tuning of endoscopes, position adjustment of operating beds, etc., to achieve fine displacement control, providing more accurate and stable support for medical operations.
Semiconductor manufacturing: In chip processing, chip placement and testing equipment, linear lead modules play a key role in precision positioning to ensure high precision and high efficiency in semiconductor manufacturing processes.
Packaging machinery: used to achieve the accurate development and positioning of packaging materials, improve packaging efficiency and accuracy, and ensure the quality and consistency of product packaging.
3D printing equipment: It can realize the precise movement of the print head, which helps to improve the printing accuracy and quality, and meet the printing needs of complex shapes and high-precision models.
Laser processing equipment: In the laser cutting machine, engraving machine and other equipment, control the position and speed of the laser head, so that the laser processing process is more accurate and efficient, improve the processing quality and efficiency.